| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| W25N01GVZEIG/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| W25Q512JVEIQ/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| EG27325 | EG/屹晶微 |
SOP8 |
24+ |
100000 |
||||
| EG3012S | EG/屹晶微 |
SOP8 |
24+ |
100000 |
||||
| SDA7123 | IC |
西南集成 |
LQFP-48 |
24+ |
20000 |
|||
| BY25Q32CSSIG | 存储IC |
BOYAMICRO/博雅 |
24+ |
50000 |
||||
| BY25Q128ESSIG | 存储IC |
BOYAMICRO/博雅 |
24+ |
50000 |
||||
| XM25QH256CXIQT08S | 存储IC |
XMC/武汉新芯 |
WSON-8 |
24+ |
200000 |
|||
| JX-F37P-C1-M3 | IC |
晶相光电 |
CSP |
24+ |
16800 |
|||
| JX-F38PA-C1-M3 | IC |
SOI/晶相 |
CSP |
24+ |
96000 |
|||
| EN25QH128A-104HIP2T | IC |
EMST |
SOP-8 |
24+ |
108000 |
|||
| ICM-42688-P | IC |
INVENSENSE/应美盛 |
LGA |
24+ |
100000 |
|||
| W25Q256JVEIQ/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| W25Q128JVSIQ/REEL | 存储IC |
WINBOND/华邦 |
SOP8(208mil) |
24+ |
100000 |
|||
| EG3013S | EG/屹晶微 |
SOP8 |
24+ |
100000 |
||||
| SX1276IMLTRT | IC |
SEMTECH/升特 |
QFN-28-EP |
24+ |
50000 |
|||
| SC7A20HTRLG | IC |
SILAN/士兰微 |
LGA-12-2x2x1.0 |
24+ |
50000 |
|||
| BY25Q256FSSIG | 存储IC |
珠海博雅/BOYA |
SOP-8 |
24+ |
600000 |
|||
| BY25Q32ESTIG | 存储IC |
BOYAMICRO/博雅 |
SOP-8 |
24+ |
100000 |
|||
| JX-K17-C1-M3 | IC |
晶相光电 |
CSP |
24+ |
12000 |
|||
| PT5619 | IC |
PTC/普诚 |
TSSOP-20 |
24+ |
30000 |
|||
| JX-F37PA-C1-M3 | IC |
SOI/晶相 |
CSP |
24+ |
84000 |
|||
| W25N02KVZEIR/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| W25Q512JVFIQ/REEL | 存储IC |
WINBOND/华邦 |
SOP16(300mil) |
24+ |
100000 |
|||
| JX-F22-P1-M6 | IC |
晶相光电 |
CSP |
24+ |
14400 |
|||
| EG3003 | 驱动IC |
EG/屹晶微 |
SOP8 |
24+ |
100000 |
|||
| EG3001 | 驱动IC |
EG/屹晶微 |
SOP8 |
24+ |
100000 |
|||
| BY25Q64ESSIG | 存储IC |
BOYAMICRO/博雅 |
24+ |
50000 |
||||
| JX-S02-C1 | IC |
晶相光电 |
CSP |
24+ |
32000 |
|||
| MP9943GQ-Z | IC |
MPS/美国芯源 |
QFN-8 |
24+ |
35000 |