| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| JX-F37P-C1-M3 | IC |
晶相光电 |
CSP |
24+ |
16800 |
|||
| JX-F38PA-C1-M3 | IC |
SOI/晶相 |
CSP |
24+ |
96000 |
|||
| EN25QH128A-104HIP2T | IC |
EMST |
SOP-8 |
24+ |
108000 |
|||
| W25N01GWZEIG/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| W25Q64JVSSIQ/REEL | 存储IC |
WINBOND/华邦 |
SOP8(208mil) |
24+ |
100000 |
|||
| W25Q32JVSSIQ/TUBE | 存储IC |
WINBOND/华邦 |
SOP8(208mil) |
24+ |
100000 |
|||
| W634GU6QB-11/ TRAY | 存储IC |
WINBOND/华邦 |
VFBGA96(7.5X13MM2) |
24+ |
100000 |
|||
| JX-F23A-C1-M3 | IC |
晶相光电 |
CSP |
24+ |
16800 |
|||
| EG27324 | 驱动IC |
EG/屹晶微 |
SOP8 |
24+ |
100000 |
|||
| ETA3426D2G | IC |
ETASOLUTIONS/钰泰 |
DFN-6 |
24+ |
60000 |
|||
| GX8008C | IC |
杭州国芯NationalChip |
QFN-52 |
24+ |
400000 |
|||
| W25Q64FWSSAQ | 存储IC |
WINBOND/华邦 |
SOP-8 |
24+ |
120000 |
|||
| JX-K305P-C1-M3 | 视觉、图像传感器 |
晶相光电 |
CSP |
25+ |
49800 |
|||
| AV2018-S85QFG | IC |
AIROHA 络达 |
QFN |
24+ |
36000 |
|||
| W634GU6RB-11 | 存储IC |
WINBOND/华邦 |
BGA |
25+ |
15840 |
|||
| HE24C02DFH | IC |
HUAHONG/华虹 |
DFN-8 |
24+ |
303000 |
|||
| BY25Q32ESSIG | 存储IC |
BOYAMICRO/博雅 |
24+ |
50000 |
||||
| BY25Q128ESWIG | 存储IC |
珠海博雅/BOYA |
WSON-8-6*5 |
24+ |
50000 |
|||
| BY25Q32ESTIG | 存储IC |
珠海博雅/BOYA |
SOP-8 |
24+ |
100000 |
|||
| JX-H68-C1-M6 | IC |
晶相光电 |
CSP |
24+ |
14400 |
|||
| JX-Q03P-C1-M3 | IC |
晶相光电 |
CSP |
24+ |
32000 |
|||
| EFM8BB52F32G-C-QFN32R | IC |
SILICON/芯科 |
22+ |
800000 |
||||
| GD5F2GM7UEYIG | 存储IC |
GD/兆易创新 |
WSON-8 |
24+ |
200000 |
|||
| JX-S02-C1 | IC |
晶相光电 |
CSP |
24+ |
32000 |
|||
| MP9943GQ-Z | IC |
MPS/美国芯源 |
QFN-8 |
24+ |
35000 |
|||
| W25N02KVZEIR/REEL | 存储IC |
WINBOND/华邦 |
WSON(8x6mm) |
24+ |
100000 |
|||
| W25Q512JVFIQ/REEL | 存储IC |
WINBOND/华邦 |
SOP16(300mil) |
24+ |
100000 |
|||
| JX-F22-P1-M6 | IC |
晶相光电 |
CSP |
24+ |
14400 |
|||
| EG3003 | 驱动IC |
EG/屹晶微 |
SOP8 |
24+ |
100000 |
|||
| EG3001 | 驱动IC |
EG/屹晶微 |
SOP8 |
24+ |
100000 |